Upper Cover Tape / Lower Cover Tape
This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions. The product features precisely controlled peel strength, preventing adhesive residue during automatic peeling and effectively avoiding contamination of precision components. Its unique anti-static design maintains surface resistivity within the range of 10^6 to 10^9 Ω, completely eliminating the risk of component displacement caused by electrostatic accumulation. This makes it particularly suitable for packaging static-sensitive products such as IC chips and microelectronic components.
The product employs a multi-layer composite structure, with a surface layer that offers excellent abrasion and tear resistance, a middle functional layer that provides stable adhesive strength, and a bottom protective film that ensures cleanliness during transportation and storage. The thickness is controlled within the range of 0.05-0.08 mm, guaranteeing sufficient mechanical strength while maintaining excellent flexibility and adhesion. In practical applications, the top cover tape is perfectly compatible with various types of carrier tapes, including plastic ones such as PS, PET, and PC, as well as specialized paper-based carrier tapes, demonstrating exceptional adaptability. Its precise tension control system ensures stable operation on high-speed automatic packaging equipment, with the capability to accommodate production speeds of up to 300 cycles per minute. This makes it an ideal choice for modern electronics manufacturing enterprises seeking to enhance production efficiency and ensure product quality.
This product is manufactured using high-strength composite materials, offering excellent dimensional stability and mechanical strength to ensure consistent shape and performance in high-speed automated production processes. The surface is specially treated to provide an appropriate friction coefficient and outstanding anti-static properties, effectively preventing component displacement during transportation while protecting sensitive devices from electrostatic damage.
The design of the bottom cover tape fully meets the stringent demands of modern electronics manufacturing. Its precision positioning holes and standard dimensional specifications ensure perfect compatibility with various automated equipment. The product maintains uniform thickness, with tolerances controlled within ±0.01mm—a high-precision manufacturing process that guarantees accurate component placement during packaging. In terms of material selection, the bottom cover tape is made from eco-friendly polymer materials, free of heavy metals and harmful substances, and complies with RoHS environmental standards. The product also exhibits excellent temperature resistance, maintaining stable physical properties in environments ranging from -40℃ to 85℃, ensuring reliable use across diverse global climate conditions.
In practical applications, the bottom cover tape demonstrates exceptional performance. Its unique surface coating technology ensures reliable bonding with the top cover tape while allowing easy separation when needed, without causing any damage to the components. The product is available in multiple specifications, meeting the packaging needs of components of various sizes—from 0201 miniature components to QFP large-scale integrated circuits. It serves as an essential foundational material for electronics manufacturers to achieve efficient and reliable production.