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Self-Adhesive Cover Tape - High-Quality Solutions from China Suppliers & Factory for Efficient Packaging
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Self-Adhesive Cover Tape - High-Quality Solutions from China Suppliers & Factory for Efficient Packaging

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Introducing the Self-Adhesive Cover Tape Series, a product developed by leading China suppliers utilizing advanced precision coating technology for optimal adhesion. With its unique ability to bond at ambient temperatures, this tape simplifies the packaging process significantly by eliminating the need for heating, leading to reduced energy costs.

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This versatile series is scientifically categorized into four distinct grades based on bonding strength requirements:
Low Tack (YJLG-80/81): Featuring a peel force of 30-70g, ideal for applications needing frequent opening.
Medium Tack (YJLG-83/85): Offers a peel force of 60-90g, providing a perfect balance between seal integrity and ease of opening.
High Tack (YJLG-86/87): With a peel force of 70-120g, it delivers enhanced sealing assurance for various uses.
Super High Tack (YJLG-87+/89): This grade meets the most demanding sealing requirements with a powerful peel force of 100-150g.

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All models boast consistently superior mechanical properties, including tensile strength of ≥2.5kg and elongation of ≥30%, with thickness meticulously controlled within 0.06mm ± 0.005mm. This ensures reliability and performance, making our Self-Adhesive Cover Tape an excellent choice for customers seeking high-quality solutions from an established factory.

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    Product Details

    Model Peel Force (g) Tensile Strength (kg) Elongation (%) Thickness (mm) ±0.005 Specifications (mm)
    Low Tack (YJLG-80/81) 30–70 ≥2.5 ≥30 0.06 Standard range: 5.4–97.5 mm
    Custom sizes: Fully supported.
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    Low Peel Adhesion 30–70g peel force for gentle bonding and residue-free removal
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    Ultra-Thin Profile 0.06mm thickness with ±0.005mm tolerance for precision applications
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    Strong Mechanical Properties Tensile strength ≥2.5kg and elongation ≥30% prevent breakage
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    Flexible Sizing Standard widths 5.4–97.5mm; custom sizes fully supported

    YJLG-80/81 is a low-adhesion electronic tape specifically designed for applications requiring gentle bonding and easy peeling. With a peel adhesion force controlled between 30–70 grams, it ensures effective bonding during the encapsulation process while allowing easy removal when needed, leaving no residue—making it particularly suitable for precision component encapsulation that demands high surface cleanliness.

    The product features a uniform thickness of 0.06mm (tolerance ±0.005mm), maintaining a slim profile while offering excellent mechanical properties—tensile strength ≥2.5kg and elongation ≥30%—ensuring it resists breakage or deformation during high-speed mounting and transportation.

    It is widely used in light encapsulation scenarios such as LEDs and flexible circuit boards, where both adhesion strength and electrostatic protection are critical.

    Anti-Static Grade Options
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    Single-Sided Brown
    10⁵ – 10⁸ Ω
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    Single-Sided Light Blue
    10⁶ – 10¹⁰ Ω
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    Double-Sided Anti-Static
    10⁶ – 10¹¹ Ω
    Frequently Asked Questions
    What is the peel adhesion force of YJLG-80/81, and why does it matter?
    The peel adhesion force of YJLG-80/81 is controlled between 30–70 grams. This low-tack level ensures the tape bonds effectively during encapsulation while allowing clean, residue-free removal—critical for maintaining surface cleanliness on precision electronic components.
    What anti-static grades are available for YJLG-80/81?
    YJLG-80/81 offers three anti-static options: single-sided brown (10⁵–10⁸Ω), single-sided light blue (10⁶–10¹⁰Ω), and double-sided anti-static (10⁶–10¹¹Ω). Users can select the appropriate grade based on the electrostatic sensitivity of their components.
    What sizes are available, and can custom widths be ordered?
    The standard width range covers 5.4mm to 97.5mm. Custom sizes are fully supported, allowing manufacturers to specify exact dimensions to match their production line requirements.
    Is YJLG-80/81 suitable for high-speed automated mounting processes?
    Yes. With tensile strength ≥2.5kg and elongation ≥30%, YJLG-80/81 is engineered to withstand the mechanical stress of high-speed mounting and transportation without breaking or deforming.
    What applications is YJLG-80/81 primarily designed for?
    YJLG-80/81 is primarily designed for light encapsulation applications such as LEDs and flexible circuit boards (FPCs), where both precise adhesion control and reliable electrostatic protection are essential.
    Does YJLG-80/81 leave any residue after removal?
    No. YJLG-80/81 is specifically formulated to peel away cleanly without leaving adhesive residue on component surfaces, making it ideal for applications where surface cleanliness and contamination control are paramount.