Jiangsu Yongjia's high-end heat-sealing tape helps upgrade semiconductor packaging

As China's semiconductor industry accelerates its domestic substitution process, technological breakthroughs in packaging materials have become crucial for the industry chain's self-reliance and controllability. Jiangsu Yongjia Electronic Materials Co., Ltd. focuses on the R&D of core products such as heat-sealing tapes. With four advanced coating lines and a complete set of precision processing equipment, it has successfully achieved large-scale production of low-warpage, high-cleanliness heat-sealing tapes. The heat-sealing strength of its products consistently reaches over 0.8 N/mm, and the surface resistivity is controlled within 1×10⁹Ω, placing its performance indicators among the top in the industry.

As a key consumable in the semiconductor packaging process, the performance of heat-sealing tape directly affects chip transportation safety and packaging yield. Jiangsu Yongjia has optimized polyester film modification and surface treatment technologies to meet the needs of advanced packaging processes such as FC-BGA and Chiplet, achieving precise thickness control of its products below 38μm, making them suitable for ultra-small component packaging with dimensions smaller than 0.1005. Relying on 46 sets of supporting slitting and cutting equipment, the company achieves end-to-end quality control from raw material processing to finished product delivery. Currently, its products have passed certifications from multiple mainstream packaging and testing manufacturers and are being used in batches in the consumer electronics and AI chip fields.

According to data from the China Electronic Materials Industry Association, the domestic cover tape market size exceeded 4.8 billion yuan in 2025, with heat-sealing cover tapes accounting for 76.3%. Jiangsu Yongjia seized this market opportunity, launching a customizable heat-sealing solution that provides compatible products for different carrier tape materials, shortening the response time to less than 7 days. In the future, the company will continue to increase its R&D investment, focusing on the application of environmentally friendly and recyclable materials, to help domestically produced cover tapes further expand their market share in the high-end packaging field.