High-Temperature Anti-Static Tape Series YJRG-51A/51BA - ESD Protection from China Suppliers and Factory
| Standard (Transparent) |
Single-Sided ESD (Light Blue) Surface Resistivity: 106–1010 Ω |
Double-Sided ESD (Dark Blue) Surface Resistivity: 106–1011 Ω |
Thickness (mm) ±0.006 |
Tensile Strength (kg) | Elongation (%) | Sealing Temp. (℃) Standard |
Sealing Temp. (℃) High-Speed |
Peel Force (g) | Compatible Carrier Tape |
|---|---|---|---|---|---|---|---|---|---|
| YJRG-51A | YJRG-51-1L | YJRG-51-1LS | 0.06 | ≥2.5 | ≥30 | 160–190 | 190–250 | 30–90 | PS |
📦
Series Overview
The YJRG-51A series cover tape consists of the base model YJRG-51A, the single-sided anti-static model YJRG-51-1L, and the double-sided anti-static model YJRG-51-1LS. With a thickness design of 0.06mm, this series is slightly thicker than other series, giving it unique advantages in applications requiring enhanced mechanical protection.
💪
Mechanical Performance
The product delivers reliable mechanical performance, featuring a tensile strength ≥2.5 kg and elongation ≥30%. This parameter combination ensures stable protective performance during both packaging and use.
🌡️
Thermal & Sealing Properties
This series offers a conventional sealing temperature range of 160–190°C, which is slightly higher than other series, while also accommodating high-speed sealing processes at 190–250°C. This characteristic enables it to meet special process requirements.
🔒
Peel Force & ESD Protection
The peel force range of 30–90 g is rationally designed to ensure secure sealing while maintaining rework convenience. Specifically designed for use with PS carrier tapes, the double-sided anti-static model provides comprehensive protection for highly sensitive electronic components, effectively preventing electrostatic damage and improving product reliability.
❓ Frequently Asked Questions
Q
What are the differences between YJRG-51A, YJRG-51-1L, and YJRG-51-1LS?
YJRG-51A is the standard transparent version with no anti-static treatment. YJRG-51-1L is a single-sided ESD version (light blue) with a surface resistivity of 106–1010 Ω, suitable for moderately sensitive components. YJRG-51-1LS is the double-sided ESD version (dark blue) with a surface resistivity of 106–1011 Ω, offering the highest level of electrostatic protection for the most sensitive electronic parts.
Q
What carrier tape is the YJRG-51A series compatible with?
The YJRG-51A series cover tapes are specifically designed for use with PS (Polystyrene) carrier tapes, ensuring optimal adhesion performance and reliable component retention throughout the packaging and shipping process.
Q
What sealing temperatures are recommended for the YJRG-51A series?
For standard sealing processes, the recommended temperature range is 160–190°C. For high-speed automated sealing machines, the temperature range can be extended to 190–250°C, making this series versatile enough to accommodate both conventional and high-throughput production lines.
Q
Why is the thickness of the YJRG-51A series set at 0.06mm?
At 0.06mm, the YJRG-51A series is slightly thicker than comparable cover tape series. This additional thickness provides enhanced mechanical protection for packaged components, making it particularly advantageous in applications where components are subject to greater physical stress during handling, transportation, or automated assembly.
Q
What does the peel force range of 30–90g mean for practical use?
A peel force of 30–90g is carefully balanced to serve two purposes: the lower end ensures that components can be easily accessed during rework or pick-and-place operations, while the upper end guarantees a secure seal that prevents components from falling out or shifting during packaging and transport. This range is suitable for most standard SMD component packaging requirements.
Q
When should I choose the double-sided ESD model (YJRG-51-1LS) over the single-sided model?
The double-sided ESD model YJRG-51-1LS should be selected when packaging highly sensitive electronic components that require electrostatic protection on both the top and bottom surfaces. This is especially important for components with very low electrostatic discharge thresholds, such as advanced ICs, MOSFETs, and other precision semiconductor devices, where even minimal static buildup could cause latent or immediate damage.


