High-Performance Upper & Lower Cover Tape for SMD Packaging | China Suppliers & Factory
This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions. The product features precisely controlled peel strength, preventing adhesive residue during automatic peeling and effectively avoiding contamination of precision components.
Its unique anti-static design maintains surface resistivity within the range of 10^6 to 10^9 Ω, completely eliminating the risk of component displacement caused by electrostatic accumulation. This makes it particularly suitable for packaging static-sensitive products such as IC chips and microelectronic components.
The product employs a multi-layer composite structure, with a surface layer that offers excellent abrasion and tear resistance, a middle functional layer that provides stable adhesive strength, and a bottom protective film that ensures cleanliness during transportation and storage. The thickness is controlled within the range of 0.05-0.08 mm, guaranteeing sufficient mechanical strength while maintaining excellent flexibility and adhesion.
Temp Range
-10°C to 60°C stable adhesive performance.
Anti-Static
10^6 to 10^9 Ω surface resistivity.
Thickness
Precision controlled within 0.05-0.08 mm.
High Speed
Supports up to 300 cycles per minute.
Application Compatibility: In practical applications, the top cover tape is perfectly compatible with various types of carrier tapes, including plastic ones such as PS, PET, and PC, as well as specialized paper-based carrier tapes. Its precise tension control system ensures stable operation on high-speed automatic packaging equipment, making it an ideal choice for modern electronics manufacturing enterprises seeking to enhance production efficiency and ensure product quality.
Frequently Asked Questions (FAQ)
The product maintains stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions.
No. The product features precisely controlled peel strength, which prevents adhesive residue during automatic peeling and effectively avoids contamination of precision components.
The unique anti-static design maintains surface resistivity within the range of 10^6 to 10^9 Ω, completely eliminating the risk of component displacement caused by electrostatic accumulation. This makes it ideal for IC chips and microelectronic components.
It employs a multi-layer composite structure (abrasion-resistant surface layer, stable adhesive middle layer, and bottom protective film) with a controlled thickness of 0.05-0.08 mm to guarantee mechanical strength and flexibility.
Yes. Its precise tension control system ensures stable operation on high-speed automatic packaging equipment, accommodating production speeds of up to 300 cycles per minute.
It is perfectly compatible with various types of carrier tapes, including plastic carrier tapes (PS, PET, and PC) as well as specialized paper-based carrier tapes.



