High-Performance Upper and Lower Cover Tape for SMD Packaging - China Suppliers & Factory
This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions. The product features precisely controlled peel strength, preventing adhesive residue during automatic peeling and effectively avoiding contamination of precision components.
Stable adhesive performance from -10°C to 60°C, reliable under all environmental conditions.
Surface resistivity maintained at 10⁶ to 10⁹ Ω, eliminating electrostatic accumulation risks.
No adhesive residue during automatic peeling — prevents contamination of precision components.
Supports production speeds of up to 300 cycles per minute on automatic packaging equipment.
The product employs a multi-layer composite structure: a surface layer with excellent abrasion and tear resistance, a middle functional layer providing stable adhesive strength, and a bottom protective film ensuring cleanliness during transportation and storage. Thickness is precisely controlled within 0.05–0.08 mm, guaranteeing sufficient mechanical strength while maintaining excellent flexibility and adhesion.
- Plastic Carrier Tapes: PS (Polystyrene), PET (Polyethylene Terephthalate), PC (Polycarbonate)
- Specialized Paper-Based Carrier Tapes
| Specification | Value / Range |
|---|---|
| Operating Temperature Range | -10°C to 60°C |
| Surface Resistivity | 10⁶ – 10⁹ Ω |
| Thickness | 0.05 – 0.08 mm |
| Max Production Speed | 300 cycles / minute |
| Structure | Multi-layer composite (3 layers) |
| Compatible Carrier Tapes | PS, PET, PC, Paper-based |
Its unique anti-static design makes it particularly suitable for packaging static-sensitive products such as IC chips and microelectronic components. The precise tension control system ensures stable operation on high-speed automatic packaging equipment, making it an ideal choice for modern electronics manufacturing enterprises seeking to enhance production efficiency and ensure product quality.



