High-Performance Upper & Lower Cover Tape from China Suppliers - Reliable Packaging Solutions Factory for SMDs
This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions.
Stable adhesive performance from -10°C to 60°C, reliable across diverse environmental conditions.
Precisely controlled peel strength prevents adhesive residue during automatic peeling, avoiding contamination of precision components.
Surface resistivity maintained at 106 to 109 Ω, eliminating electrostatic accumulation risks.
Supports production speeds of up to 300 cycles per minute on high-speed automatic packaging equipment.
Thickness controlled within 0.05–0.08 mm, balancing mechanical strength with flexibility and adhesion.
Ideal for packaging static-sensitive products such as IC chips and microelectronic components.
| Parameter | Specification |
|---|---|
| Operating Temperature | -10°C to 60°C |
| Surface Resistivity | 106 to 109 Ω |
| Thickness | 0.05 – 0.08 mm |
| Max Production Speed | Up to 300 cycles/min |
| Anti-Static | Yes (unique anti-static design) |
| Adhesive Residue | None (clean peel) |
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1Surface Layer Excellent abrasion and tear resistance for durability during handling and automation.
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2Middle Functional Layer Provides stable adhesive strength and ensures reliable bonding throughout the packaging process.
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3Bottom Protective Film Ensures cleanliness and integrity during transportation and storage.
Perfectly compatible with a wide range of carrier tape types for maximum flexibility in electronics manufacturing:



