High-Performance Upper and Lower Cover Tape for SMD Packaging - China Suppliers & Factory Solutions
This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions.
🛡️ The product features precisely controlled peel strength, preventing adhesive residue during automatic peeling and effectively avoiding contamination of precision components. Its unique anti-static design maintains surface resistivity within the range of 10⁶ to 10⁹ Ω, completely eliminating the risk of component displacement caused by electrostatic accumulation — making it ideal for packaging IC chips and microelectronic components.
Wide Temperature Range
Stable adhesive performance from -10°C to 60°C for reliable packaging in all environments.
Anti-Static Design
Surface resistivity maintained at 10⁶–10⁹ Ω, eliminating electrostatic risks for sensitive components.
Multi-Layer Composite
Surface abrasion resistance, middle adhesive layer, and bottom protective film for integrity during storage.
Precision Thickness
Controlled within 0.05–0.08 mm for optimal mechanical strength, flexibility, and adhesion.
Universal Compatibility
Compatible with PS, PET, PC plastic carrier tapes and specialized paper-based carrier tapes.
High-Speed Production
Supports production speeds of up to 300 cycles per minute on automatic packaging equipment.
| Parameter | Specification |
|---|---|
| Operating Temperature Range | -10°C to 60°C |
| Surface Resistivity | 10⁶ to 10⁹ Ω |
| Thickness | 0.05 – 0.08 mm |
| Compatible Carrier Tapes | PS, PET, PC (plastic); Paper-based |
| Max Production Speed | Up to 300 cycles/min |
| Structure | Multi-layer composite (surface / functional / protective) |



