High-Performance Upper and Lower Cover Tape Suppliers | China Factory for Electronic Component Packaging
Manufactured with special composite materials and precision coating technology, this top cover tape delivers stable adhesive performance across a broad temperature range of -10°C to 60°C — ensuring reliable packaging under diverse environmental conditions.
Maintains stable adhesive performance from -10°C to 60°C, suitable for various environmental conditions.
Precisely controlled peel strength prevents adhesive residue during automatic peeling, avoiding contamination of precision components.
Surface resistivity maintained at 10⁶ to 10⁹ Ω, eliminating electrostatic accumulation risks for IC chips and microelectronic components.
Thickness controlled within 0.05–0.08 mm, ensuring mechanical strength, flexibility, and excellent adhesion.
Tension control system supports high-speed automatic packaging equipment up to 300 cycles per minute.
Surface abrasion resistance layer + middle adhesive layer + bottom protective film — ensuring cleanliness during transport and storage.
The product employs a multi-layer composite structure, with a surface layer that offers excellent abrasion and tear resistance, a middle functional layer that provides stable adhesive strength, and a bottom protective film that ensures cleanliness during transportation and storage. The thickness is controlled within the range of 0.05–0.08 mm, guaranteeing sufficient mechanical strength while maintaining excellent flexibility and adhesion.
| Parameter | Specification |
|---|---|
| Operating Temperature Range | -10°C to 60°C |
| Surface Resistivity | 10⁶ to 10⁹ Ω |
| Tape Thickness | 0.05 – 0.08 mm |
| Max. Production Speed | Up to 300 cycles/min |
| Anti-Static | Yes (unique anti-static design) |
| Adhesive Residue | None (precisely controlled peel strength) |
- PS (Polystyrene)
- PET (Polyester)
- PC (Polycarbonate)
- Paper-Based Carrier Tapes
This top cover tape is particularly suitable for packaging static-sensitive products such as IC chips and microelectronic components. Its precise tension control system ensures stable operation on high-speed automatic packaging equipment, making it an ideal choice for modern electronics manufacturing enterprises seeking to enhance production efficiency and ensure product quality.



